FR 1,27/ 68-MV 3,25 - SMD male connectors
1337144

SMD male connector, nominal current: 2.2 A, test voltage: 840 V AC, number of positions: 68, pitch: 1.27 mm, color: black, contact surface: Au, contact connection type: Pin, mounting: SMD soldering

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Your advantages

The first high-speed data transmission at up to 28 Gbps using the established market standard, opens up new design possibilities.​
Robust 6-pos. to 100-pos. board-to-board and wire-to-board connectors ensure greater flexibility with regard to component options.
Time savings during the development process with customer-specific simulations for data integrity
Gold-plated contact points enable long-term stable signal transmission and currents of up to 2.3 A.
Design-in support during device development using MCAD/ECAD data and a free sample service

Frequently asked questions


Can I get specific versions for my individual application?

Yes, in addition to our standard items, we also develop customer-specific versions for connecting PCBs within the device. Customer-specific versions range from different position number versions and modified gold layer thicknesses to extended stack h... View more

Yes, in addition to our standard items, we also develop customer-specific versions for connecting PCBs within the device. Customer-specific versions range from different position number versions and modified gold layer thicknesses to extended stack heights and completely new designs. We will be happy to advise you on the design and implementation of your requirements.

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What makes the board-to-board connector FR 1,27 so special?

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The FR 1,27 series offers improved product properties in a standard market format - an innovation within the form-fit-function specifications. The high-quality contact design enables a current transmission of 2.3 A per contact (50-pos. at 20°C) and h... View more

The FR 1,27 series offers improved product properties in a standard market format - an innovation within the form-fit-function specifications. The high-quality contact design enables a current transmission of 2.3 A per contact (50-pos. at 20°C) and high-speed data transmission of up to 28 Gbps. The number of different positions ranges from 6 ... 100, offering high flexibility for the device design.

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Can I also achieve higher nominal currents than 2.3 A per contact?

Yes, the nominal current is 2.3 A per contact for a fully energized, 50-pos. connector at an ambient temperature of 20°C. With effective energization of six positions, up to 3.7 A per contact is possible. The derating curve in accordance with IEC 605... View more

Yes, the nominal current is 2.3 A per contact for a fully energized, 50-pos. connector at an ambient temperature of 20°C. With effective energization of six positions, up to 3.7 A per contact is possible. The derating curve in accordance with IEC 60512-5-2 shows the temperature-dependent current carrying capacity for different numbers of positions. We are happy to support you with the individual consideration of your application.

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I am currently using a 1.27 mm pitch board-to-board connector from another manufacturer. Is it possible to switch to FR 1,27?

Yes, the FR 1,27 series is layout- and plug-in compatible with standard connectors from other manufacturers. It is ideal as a second source. Test reports are available on request.


In which numbers of positions is the FR 1,27 series board-to-board connector available?

The FR 1,27 connector is available in the following numbers of positions: 6, 12, 16, 20, 26, 32, 40, 50, 68, 80, and 100.
The IDC female connector strips are available in 12-, 16-, 20-, 26-, 32-, 40-, 50-, 68-, and 80-position versions.


Does the specified data transmission rate apply to all combinations?

No, the specified data transmission rate refers to an example combination. It may vary depending on the item combination. Factors such as different stack heights - due to longer or shorter contacts - influence the signal quality and thus the achievab... View more

No, the specified data transmission rate refers to an example combination. It may vary depending on the item combination. Factors such as different stack heights - due to longer or shorter contacts - influence the signal quality and thus the achievable data rate. We can work with you to optimize high-speed data transmission for individual applications. Feel free to contact us.

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Where is position 1?

Position a1 (row a, pin 1) is marked on the item. Position 1 is also marked in the TecDoc drawings (product family drawing and packaging drawing). The orientation of the item for PCB assembly and the plug-in direction are thus clearly defined. The cu... View more

Position a1 (row a, pin 1) is marked on the item. Position 1 is also marked in the TecDoc drawings (product family drawing and packaging drawing). The orientation of the item for PCB assembly and the plug-in direction are thus clearly defined. The customer can provide a different definition in its own documentation.

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Where can I find information on extended air clearances and creepage distances to realize the necessary voltage requirements in my application?

The minimum distances are specified in the technical data. We are happy to calculate distances for partially assembled connectors or between omitted pins (so-called death metal parts) on request. This means that increased voltage requirements can also be realized.


Where can I find out more about board-to-board connectors?

You can find white papers, new products, product information, videos, etc., under ’Board-to-board connectors’ in the ’Products’ section of our website. Download the ‘FINEPITCH board-to-board connectors’ brochure as an e-paper. This provides details o... View more

You can find white papers, new products, product information, videos, etc., under ’Board-to-board connectors’ in the ’Products’ section of our website. Download the ‘FINEPITCH board-to-board connectors’ brochure as an e-paper. This provides details on applications, contact systems, and the technical properties of the products. It also provides information on data transmission, electromagnetic compatibility (EMC), and the SMD soldering process.

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