cULus Recognized
Approval ID: E118976-20230512| Nominal voltage UN | Nominal current IN | Cross section AWG | Cross section mm2 | |
|---|---|---|---|---|
| keine | ||||
| 29.9 V | 0.5 A | |||
FS 0,635/ 40-FV-R- 4,0
-
SMD female connectors
1333897
SMD female connector, nominal current: 0.5 A, test voltage: 500 V AC, number of positions: 40, pitch: 0.635 mm, color: black, contact surface: Au, contact connection type: Socket, mounting: SMD soldering
Number of positions
Product details
| Product type | SMD female connector |
| Product family | FS 0,635/..-FV-R- 4,0 |
| Number of positions | 40 |
| Pitch | 0.635 mm |
| Number of rows | 2 |
| Pin layout | Linear pad geometry |
| Properties | |
| Nominal current IN | 0.5 A IEC 60512-5-2:2002-02 (40-pos. / 60-pos.) |
| Contact resistance | 40 mΩ |
| Test voltage | 500 V AC IEC 60512-4-1:2003-05 |
| Rated voltage (I/1) | 125 V |
| Rated surge voltage (I/1) | 0.8 kV |
| Data transmission | |
| Data transmission rate | 20 Gbps |
| Mounting type | SMD soldering |
| Pin layout | Linear pad geometry |
| Processing notes | |
| Process | Reflow soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Selective coating |
| Metal surface contact area (top layer) | Gold (Au) |
| Metal surface contact area (middle layer) | Nickel (Ni) |
| Metal surface soldering area (top layer) | Tin (Sn) |
| Metal surface soldering area (middle layer) | Nickel (Ni) |
| Material data - housing | |
| Color (Housing) | black (9005) |
| Insulating material | LCP |
| Insulating material group | IIIb |
| CTI according to IEC 60112 | 150 |
| Flammability rating according to UL 94 | V0 |
| Notes on operation | The permissible voltage during operation depends on the application, taking into consideration the air clearances and creepage distances within the scope of insulation requirements in accordance with IEC 60664-1. |
| Dimensional drawing |
|
| Pitch | 0.635 mm |
| Width [w] | 20.57 mm |
| Height [h] | 4.6 mm |
| Length [l] | 6.4 mm |
| Installed height | 4 mm |
| Application | |
| Contact cover | 0.6 mm |
| Center offset | ± 0.5 mm in longitudinal and transverse direction |
| Stack height | 6 mm Tolerance: +0.6 mm (in combination with Range of articles:FS 0,635/..-MV-R- 5,0) |
| 9 mm Tolerance: +0.6 mm (in combination with Range of articles:FS 0,635/..-MV-R- 8,0) | |
| 10 mm Tolerance: +0.6 mm (in combination with Range of articles:FS 0,635/..-MV-R- 9,0) | |
| Wipe length | 0.6 mm |
| Angular tolerance | ± 10 ° in longitudinal and transverse direction (when plugging in) |
| ± 2 ° in longitudinal and transverse direction (when plugged in) | |
| PCB design | |
| Pad geometry | 0.35 x 2.5 mm |
| Hole diameter | 0.9 mm |
| Thermal test | Test group C | |
| Specification | IEC 60512-5-2:2002-02 |
| Tested number of positions | 60 |
| Insulation resistance | |
| Specification | IEC 60512-3-1:2002-02 |
| Insulation resistance, neighboring positions | ≥ 5 GΩ |
| Air clearances and creepage distances | | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | IIIb |
| Minimum value for clearance and creepage distance | 0.19 mm |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 55 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 1.52 mm |
| Acceleration | 181 m/s² |
| Test duration per axis | 2 h |
| Test directions | X-, Y- and Z-axis |
| Durability test | |
| Specification | IEC 60512-9-1:2010-03 (following) |
| Contact resistance R1 | 40 mΩ |
| Contact resistance R2 | 40 mΩ |
| Insertion/withdrawal cycles | 50 |
| Insulation resistance, neighboring positions | ≥ 5 GΩ |
| Climatic test | |
| Specification | IEC 60068-2-60:2015-06 |
| Corrosive stress | Method 4, 10 days |
| Thermal stress | 125 °C/168 h |
| Power-frequency withstand voltage | 500 V |
| Ambient conditions | |
| Ambient temperature (operation) | -55 °C ... 125 °C |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Dimensional drawing |
|
| Type of packaging | 44 mm wide tape |
| [W] tape width | 44 mm |
| [W2] coil overall dimension | ≤ 50.4 mm |
| [A] coil diameter | ≤ 330 mm |
| Outer packaging type | Transparent-Bag |
Compatible products
Your advantages
Design-in support during device development using MCAD/ECAD data and a free sample service
Cost and space savings with the comprehensive portfolio available in various stack heights
Easy mating with integrated keyways and tolerance compensation for error-free production
Time savings during the development process with customer-specific simulations for data integrity
High-speed data transmission up to 30 Gbps for various possible applications
Frequently asked questions
What makes the FS 0,635 board-to-board connector so special?
The particularly space-saving board-to-board connectors enable high-speed data transmission of up to 40 Gbps and a current carrying capacity of 0.5 A per contact. The floating version offers particularly high tolerance compensation during insertion a... View more
The particularly space-saving board-to-board connectors enable high-speed data transmission of up to 40 Gbps and a current carrying capacity of 0.5 A per contact. The floating version offers particularly high tolerance compensation during insertion and in the inserted state. This gives you the choice between a rigid and floating connection with a compact 0.635 pitch.
View lessHow can the solder contacts on the FS 0,635 board-to-board connector be tested after the SMD soldering process?
The contacts are routed under the housing, enabling automated optical inspection (AOI).
With which numbers of positions is the FS 0,635 board-to-board connector available?
The FS 0,635 board-to-board connector is available with the following numbers of positions: 20, 40, 60, and 80.
Do the vertical items have a suction pad for automatic PCB assembly?
Yes, all standard vertical items in tape-on-reel packaging have a suction pad. The position and size are specified in the TecDoc Packaging (i.e., in the technical packaging drawing) in the download area for each item. The suction pad is removed after the reflow soldering process.
Are both mating partners designed as floating variants to enable floating?
As a rule, only one side of the plug connection is designed as a floating version and the counterpart is rigid. This already covers a very large tolerance range. The floating female connector strip can be combined with three rigid variants of the mal... View more
As a rule, only one side of the plug connection is designed as a floating version and the counterpart is rigid. This already covers a very large tolerance range. The floating female connector strip can be combined with three rigid variants of the male connector strip, so that three different stack heights between 8.0 mm and 12.6 mm can be realized.
View lessDoes the specified data transmission rate apply to all combinations?
No, the specified data transmission rate refers to an example combination. It may vary depending on the item combination. Factors such as different stack heights - due to longer or shorter contacts - influence the signal quality and thus the achievab... View more
No, the specified data transmission rate refers to an example combination. It may vary depending on the item combination. Factors such as different stack heights - due to longer or shorter contacts - influence the signal quality and thus the achievable data rate. We can work with you to optimize high-speed data transmission for individual applications. Feel free to contact us.
View lessWhere is position 1?
Position a1 (row a, pin 1) is marked on the item. Position 1 is also marked in the TecDoc drawings (product family drawing and packaging drawing). The orientation of the item for PCB assembly and the plug-in direction are thus clearly defined. The cu... View more
Position a1 (row a, pin 1) is marked on the item. Position 1 is also marked in the TecDoc drawings (product family drawing and packaging drawing). The orientation of the item for PCB assembly and the plug-in direction are thus clearly defined. The customer can provide a different definition in its own documentation.
View lessWhere can I find information on extended air clearances and creepage distances to realize the necessary voltage requirements in my application?
The minimum distances are specified in the technical data. We are happy to calculate distances for partially assembled connectors or between omitted pins (so-called death metal parts) on request. This means that increased voltage requirements can also be realized.
Where can I find out more about board-to-board connectors?
You can find white papers, new products, product information, videos, etc., under ’Board-to-board connectors’ in the ’Products’ section of our website. Download the ‘FINEPITCH board-to-board connectors’ brochure as an e-paper. This provides details o... View more
You can find white papers, new products, product information, videos, etc., under ’Board-to-board connectors’ in the ’Products’ section of our website. Download the ‘FINEPITCH board-to-board connectors’ brochure as an e-paper. This provides details on applications, contact systems, and the technical properties of the products. It also provides information on data transmission, electromagnetic compatibility (EMC), and the SMD soldering process.
View less