cULus Recognized
Approval ID: E118976| Nominal voltage UN | Nominal current IN | Cross section AWG | Cross section mm2 | |
|---|---|---|---|---|
| keine | ||||
| 30 V | 3 A | |||
FQ 2,54D/ 50-SH-0-BT
-
Female strip
1156906
SMD socket, nominal current: 3 A, test voltage: 500 V AC, number of positions: 50, pitch: 2.54 mm, color: black, contact surface: Au, contact connection type: Socket, mounting: SMD soldering
Number of positions
Product details
| Notes on operation | The permissible voltage during operation depends on the application, taking into consideration the air clearances and creepage distances within the scope of insulation requirements in accordance with IEC 60664-1. |
| Product type | SMD socket |
| Product family | FQ 2,54D/...-SH |
| Number of positions | 50 |
| Pitch | 2.54 mm |
| Number of rows | 2 |
| Pin layout | Linear pad geometry |
| Electrical characteristic | shielded |
| Properties | |
| Nominal current IN | 3 A (at 20°C 80-pos.) |
| Contact resistance | 20 mΩ |
| Test voltage | 500 V AC IEC 60512-4-1:2003-05 |
| Electrical characteristic | shielded |
| Dimensional drawing |
|
| Pitch | 2.54 mm |
| Width [w] | 63.9 mm |
| Height [h] | 5 mm |
| Length [l] | 15.74 mm |
| Installed height | 5 mm |
| Application | |
| Contact cover | 0.4 mm |
| Wipe length | 1.3 mm |
| PCB design | |
| Pad geometry | 1.04 x 1.32 mm |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Selective coating |
| Metal surface contact area (top layer) | Gold (Au) |
| Metal surface contact area (middle layer) | Nickel (Ni) |
| Metal surface soldering area (top layer) | Tin (Sn) |
| Material data - housing | |
| Color (Housing) | black (9005) |
| Insulating material | PA |
| Insulating material group | I |
| CTI according to IEC 60112 | 600 |
| Flammability rating according to UL 94 | V0 |
| Connection 1 | |
| Insulating material | PA |
| CTI according to IEC 60112 | 600 |
| Thermal test | Test group C | |
| Specification | IEC 60512-5-2:2002-02 |
| Tested number of positions | 80 |
| Insulation resistance | |
| Specification | IEC 60512-3-1:2002-02 |
| Insulation resistance, neighboring positions | > 1 GΩ |
| Air clearances and creepage distances | | |
| Insulating material group | I |
| Minimum value for clearance and creepage distance | 0.4 mm |
| Insertion and withdrawal forces | |
| Result | Test passed |
| No. of cycles | 100 |
| Insertion strength per pos. approx. | 2.9 N |
| Withdraw strength per pos. approx. | 2.9 N |
| Visual inspection | |
| Specification | IEC 60512-1-1:2002-02 |
| Result | Test passed |
| Dimension check | |
| Specification | IEC 60512-1-2:2002-02 |
| Result | Test passed |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 55 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 1.52 mm |
| Acceleration | 181 m/s² |
| Test duration per axis | 2 h |
| Test directions | X-, Y- and Z-axis |
| Durability test | |
| Specification | IEC 60512-9-1:2010-03 (following) |
| Contact resistance R1 | 20 mΩ |
| Contact resistance R2 | 30 mΩ |
| Insertion/withdrawal cycles | 100 |
| Insulation resistance, neighboring positions | > 1 GΩ |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 125 °C |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Mounting type | SMD soldering |
| Pin layout | Linear pad geometry |
| Processing notes | |
| Process | Reflow soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Type of packaging | Tube magazine |
Compatible products
Your advantages
Reliable mechanical and electrical connections thanks to the double-sided contact system
Designed for integration into the SMT soldering process
Clear and cost-optimized design
Suitable for a multitude of applications
Stacked, coplanar or orthogonal PCB connections enable maximum flexibility in the device
Frequently asked questions
With which numbers of positions is the FQ 2,54 board-to-board connector available?
The FQ 2,54 board-to-board connector is available with the following numbers of positions: 10, 20, 30, 50, and 80.
What is the FQ 2,54 board-to-board connector suitable for?
The FQ 2,54 board-to-board connector can be used universally and is suitable for the transmission of signals and currents of up to 3 A per contact.... View more
The FQ 2,54 board-to-board connector can be used universally and is suitable for the transmission of signals and currents of up to 3 A per contact.
View lessHow can the solder contacts on the FQ 2,54 board-to-board connector be tested?
The connector is soldered using the SMT method. The solder contacts are routed under the housing and can thus be checked by means of automated optical inspection (AOI).
Does the specified data transmission rate apply to all combinations?
No, the specified data transmission rate refers to an example combination. It may vary depending on the item combination. Factors such as different stack heights - due to longer or shorter contacts - influence the signal quality and thus the achievab... View more
No, the specified data transmission rate refers to an example combination. It may vary depending on the item combination. Factors such as different stack heights - due to longer or shorter contacts - influence the signal quality and thus the achievable data rate. We can work with you to optimize high-speed data transmission for individual applications. Feel free to contact us.
View lessWhere is position 1?
Position a1 (row a, pin 1) is marked on the item. Position 1 is also marked in the TecDoc drawings (product family drawing and packaging drawing). The orientation of the item for PCB assembly and the plug-in direction are thus clearly defined. The cu... View more
Position a1 (row a, pin 1) is marked on the item. Position 1 is also marked in the TecDoc drawings (product family drawing and packaging drawing). The orientation of the item for PCB assembly and the plug-in direction are thus clearly defined. The customer can provide a different definition in its own documentation.
View lessWhere can I find information on extended air clearances and creepage distances to realize the necessary voltage requirements in my application?
The minimum distances are specified in the technical data. We are happy to calculate distances for partially assembled connectors or between omitted pins (so-called death metal parts) on request. This means that increased voltage requirements can also be realized.
Where can I find out more about board-to-board connectors?
You can find white papers, new products, product information, videos, etc., under ’Board-to-board connectors’ in the ’Products’ section of our website. Download the ‘FINEPITCH board-to-board connectors’ brochure as an e-paper. This provides details o... View more
You can find white papers, new products, product information, videos, etc., under ’Board-to-board connectors’ in the ’Products’ section of our website. Download the ‘FINEPITCH board-to-board connectors’ brochure as an e-paper. This provides details on applications, contact systems, and the technical properties of the products. It also provides information on data transmission, electromagnetic compatibility (EMC), and the SMD soldering process.
View lessHow thick is the gold layer on the contacts in the contact area?
The gold layer on the contacts of standard FQ items are 10 µm thick in the contact area. Customer-specific layer thicknesses are available on request.